Umthombo wezindaba u-@hsuchingpo ushicilele izolo (24 Agasti) ku-X, wabelana ngezithombe ezi-4 ezibonisa ukwakheka kwangaphakathi kweseva ye-Apple Silicon AI eyakhiwe yi-Apple, esebenzisa i-rack yangokwezifiso engu-2U. Ngaphakathi kunamakholomu ehadiwe angu-4, ikholomu ngayinye inamayunithi ekhompuyutha angu-8, okusho ukuthi yonke le mishini kungenzeka ifakwe amaphrosesa angu-32.
Umthombo uthe encazelweni yezithombe: “Iseva ye-Apple M5.” Ngesikhathi abasebenzisi bebuza ukuthi ingabe lena yihadiwe ye-Apple Private Cloud Compute, uphendule wathi “ngamathuba amakhulu, yiyo.” Umthombo uphinde wathi le seva idinga ukusetshenziswa ne-Mac Studio, esebenza ukulawula isofthiwe.
Ngokubuka okuvela phezulu, iseva isebenzisa ikesi le-rack langokwezifiso elingu-2U (usayizi ojwayelekile wamaseva, elinobude obucishe bube ngu-8.89 cm). Ngaphakathi kunamakholomu angu-4 ehadiwe anesakhiwo esifanayo, ikholomu ngayinye inamayunithi ekhompuyutha amancane angu-8, okwenza ingqikithi yamaphrosesa noma amayunithi amaphrosesa angu-32. Ibhodi lesekhethi ngalinye liseceleni elingaphandle kwekholomu ehambisanayo, kanti ama-heatsink asemaphakathi. Kukhona nezibambi nhlangothi zombili zamabhodi esekhethi ukuze akhishwe futhi ashintshwe ngokushesha. Izithombe ezihambisana nokuthunyelwe ziboniswe ngezansi:
Amanye amabhodi esekhethi asesithombeni asuswe ama-heatsink. Esithombeni esisodwa kususwe i-thermal paste ebusweni be-chip, kwavela uphawu lwe-Apple olungaphezulu kwe-chip. Umbiko awukwazanga ukuqinisekisa imodeli ye-chip, kodwa ulinganisela ukuthi kungenzeka isondele ekucacisweni kwe-M5 Ultra (i-chip ye-M5 Ultra).
Maphakathi nekesi kunama-connector axhuma ihadiwe yamakholomu nebhodi elikhulu lokulawula elidlula kuyo yonke ikholomu. Izintambo eziphuma maphakathi kwe-baseplate ziya komunye umkhawulo wekesi, kodwa okwamanje akwaziwa ukuthi zisetshenziselwa ukunikeza amandla, ukudlulisa idatha, noma ukwenza yomibili le misebenzi.
Isakhiwo sangaphakathi seseva sakhelwe ukusebenza kahle kokugeleza komoya. Ekugcineni kwekholomu ngayinye yehadiwe kunefeni engu-1. Umoya ugeleza usuka ngaphambili kwekesi uye ngemuva, udlule ngqo emaphikweni e-heatsink ephakathi. Izinhlangothi zesakhiwo samakholomu nendawo engaphezu kwe-baseplate zixhunywe ngamakhava epulasitiki asobala, kwakheka umgudu womoya ovalekile oqondisa umoya endaweni yokupholisa.