I-TrendForce 集邦咨询 isanda kushicilela umbiko omusha wokuqonda imboni, ithi ama-chip e-AI ezinkampani ezifana ne-NVIDIA, AMD ne-Google ayaqhubeka nokuthuthuka. I-TDP ye-chip eyodwa ngokuvamile isivele idlule ku-1kW, kanti amandla eseva ye-AI esesimweni sekhabhinethi eyodwa anyukele kumakhulu ama-kW. Ngenxa yalokho, ukupholisa ngoketshezi kancane kancane kuba yisakhiwo esijwayelekile sengqalasizinda ye-AI esezingeni eliphezulu.
Ngokwemibiko, izixazululo zama-chip ezinkampani ezifana ne-NVIDIA ne-AMD sezisebenzisa ngokuphelele ubuchwepheshe bokupholisa ngoketshezi. Njengoba ama-chip e-AI ethuthuka njalo, kanti ama-CSP (inothi: abahlinzeki bezinsizakalo zamafu) esheshisa ukuthuthukiswa kwesakhiwo sezikhungo zedatha ze-AI, kulindeleke ukuthi ukufinyelela kokupholisa ngoketshezi kuma-chip e-AI kukhuphuke kusuka cishe ku-33% ngo-2025 kuye ku-53% ngo-2026.
I-Google ibe ngeyokuqala phakathi kwama-CSP ukusebenzisa ubuchwepheshe bokupholisa ngoketshezi, obumboza ngaphezu kuka-80% wamaseva ayo e-AI. Ngenxa yeminyaka eminingi yolwazi lokuzithuthukisela, i-Google isisungule isakhiwo sokupholisa ngoketshezi esenziwe ngendlela eyenziwe ngokwezidingo zayo.
Ngokombono wochungechunge lokuhlinzeka, uhlelo lokupholisa ngoketshezi luhlanganisa izingxenye ezibalulekile ezifana ne-water-cooling plate (Cold Plate), i-manifold (Manifold), kanye neyunithi yokusabalalisa ukupholisa (CDU). Uma kuqhathaniswa nohlelo lokupholisa ngomoya, luthuthukisa kakhulu ukusebenza kahle kokukhipha ukushisa, futhi luthuthukise ukusebenza kahle kokusetshenziswa kukagesi (PUE).
Njengoba inkundla ye-NVIDIA Vera Rubin isebenzisa ngokuphelele isakhiwo sokupholisa ngoketshezi se-Fanless (esingenamafeni), ukucushwa kokupholisa ngoketshezi manje kusuka ekugxileni kakhulu ku-GPU / CPU kuya ekubandakanyeni ikhadi lenethiwekhi i-CX9, ibhodi lokusabalalisa amandla (Busbar / Power Board), amamojula okuthumela nokwamukela ukukhanya, kanye nezinye izingxenye ezibalulekile. Ngalokho, inani lokupholisa ngekhabethe elilodwa liyakhuphuka.
Abahlinzeki abakhulu bama-water-cooling plate njengamanje bahlanganisa i-Cooler Master（酷冷至尊）、AVC（奇鋐科技）、BOYD（宝德）ne-Auras（双鸿科技）. Kulaba, i-AVC kulindeleke ukuthi iqale ukuthumela amamojula ama-water-cooling plate e-Vera Rubin kwikota yesithathu, futhi isivele ingene ochungechungeni lokuhlinzeka lwamapulatifomu e-AI ASIC ezinkampanini ezifana ne-AWS（亚马逊云科技）, Google, Meta ne-OpenAI.
Mayelana nama-heat spreader ahlanganiswa ne-chip, i-NVIDIA ekuqaleni yayihlele ukusebenzisa idizayini enezingxenye ezimbili enkundleni ye-Rubin ukuze ithuthukise ukusebenza kahle kokupholisa. Nokho, ngenxa yezinkinga ezifana nokugoba kwe-substrate, okwamanje kusetshenziswa isisombululo sesikhashana esinengxenye eyodwa. Ama-heat spreader enkundla ye-Rubin okwamanje ahlinzekwa yinkampani i-Jentech（健策）ngokukhethekile.