MediaTek stated at its corporate 2026Q2 earnings conference call at the end of last month that its first AI ASIC accelerator is expected to enter mass production in 2026Q2. Development of its second product is progressing smoothly, with initial production expected to begin in 2028 and mass production to start within the same year.
MediaTek has listed Intel Foundry’s EMIB-T alongside TSMC’s CoWoS, regarding both as key 2.5D heterogeneous integration advanced packaging technologies available to it. MediaTek representatives expressed agreement with analysts’ view that “EMIB is steadily progressing toward its goal of entering mass production in 2028.”
MediaTek also noted that development of its 448G SerDes (Serializer / Deserializer) high-speed I/O IP is progressing smoothly. The company is continuing to develop CPO optical interconnect system solutions on TSMC’s COUPE platform and also provides an end-to-end advanced 3.5D chip platform with three-dimensional stacking.
To ensure supply chain capacity and support the company’s strategic expansion from AI ASIC chips to full-scale systems and platforms, MediaTek’s board of directors has approved $5 billion in discretionary funding (note: approximately RMB 33.799 billion at the current exchange rate), providing additional flexibility for its business operations.